Method for forming patterned films on a substrate

A method of forming a patterned film of a desired film material onto a substrate according to a predetermined film pattern and under film deposition conditions corresponding to the desired film material, said method comprising the steps of:

• a) depositing a release layer of a release material onto a surface of the substrate, wherein said release material is thermally stable under the film deposition conditions and is soluble in at least a first or a second solution;
• b) depositing an underlayer onto said release layer, wherein said underlayer is thermally stable under the film deposition conditions and said underlayer is mechanically bonded to said release layer by a first mechanical bonding strength;
• c) patterning the predetermining film pattern through said underlayer and said release layer thereby forming a patterned underlayer and a patterned release layer and further exposing the substrate surface according to the predetermined film pattern;
• d) depositing film layer onto said patterned underlayer and the exposed substrate, thereby forming the patterned film onto the exposed surface of the substrate according to the predetermined film pattern and wherein said film layer is mechanically bonded to said patterned underlayer by a second mechanical bonding strength;
• e) weakening the first mechanical bonding strength of said release layer, wherein the weakened first mechanical bonding strength is weaker than the second mechanical bonding strength;
• f) applying an adhesive backed tape to the top of said film layer, said adhesive backed tape not contacting the patterned film;
• g) applying a pulling force to said tape to break the mechanical bond between said underlayer and said release layer, thereby stripping said film layer and said patterned underlayer away from said patterned release layer, while leaving said patterned film and said patterned release layer on the substrate;
• and,
• h) removing said patterned release layer.