US 5,208,731 AGranted

Heat dissipating assembly

AssigneeInternational Electronic Research Corporation

InventorMichael L. Blomquist

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Abstract

This invention provides an improved system for removably coupling a conductive heat sink to a chip housing. The heat sink is of the type having a plurality of pins arrayed in a grid pattern and extending perpendicularly from the top surface of a generally square base. The chip housing is of the type having opposite side walls each having latching projections. The heat sink is positioned in conductive thermal communication with an exposed portion of a computer chip or other device which is securely mounted to the housing. A flexible and resilient spring clip is adapted to fit within the passages defined by the spaces between the pins on the heat sink. The flexibility of the spring clip allows portions along opposing walls of the spring clip to be stretched and guided over the latching projections. The resiliency of the spring clip provides a spring bias sufficient to retain the heat sink in conductive thermal communication with the chip element under required working conditions. The resilient forces of the stretched spring clip are not so great as to prevent the quick and easy manual insertion and removal of the spring clip.

Claims13

Dependent claims

An improved heat dissipating assembly of the type including a socket and at least one first latching element disposed on respective opposing sides of said socket, a electronic device, the electronic device being adapted to be mounted to said socket, a heat sink member, and an retainer element, said retainer element being adapted to removably retain said heat sink member in a position to remove heat from the electronic device by conduction, said heat sink member having a first surface generally adapted to conform to an exposed mating surface of the electronic device, said heat sink member including a second surface and a plurality of outwardly projecting heat dissipating members arranged on said second surface so as to define therebetween a plurality of first channels extending generally in a first direction and a plurality of second channels extending generally in a second direction, said second direction being generally perpendicular to said first direction, said first and second channels being of generally equal lengths and depths, said retainer element including side panel portions depending from and integral with respective opposite ends of a plurality of relatively narrow mutually parallel spaced apart spring elements, said spring elements being adapted to hold said panel portions in an unassembled configuration and to be received in and extend along said first channels, each of said side panel portions having at least one second latching element adapted to latch with at least one said first latching element in an assembled configuration;

wherein the improvement comprises:
said panel portions being spaced apart in said unassembled configuration by a distance which is less than the distance between said respective opposing sides of said socket, whereby said socket is resiliently clamped between said panel portions in said assembled configuration, cross member means integral with and transverse to each of said spring elements and intermediate said side panel portions, said cross member means lying in a common plane with a midportion of said spring elements and being adapted to be received in at least one of said second channels, whereby the engagement of said cross member means in said least one of said second channels prevents substantial relative longitudinal movement between said spring elements and said heat sink, said panel portions extending toward said opposing sides of said socket at a shallow angle whereby said panel portions generally make approximate line contact with said opposing sides in the general location of said latching elements.

An improved heat dissipating assembly for electronic devices of the type including a socket and first latching elements disposed on respective opposing sides of said socket, an electronic device, the electronic device being adapted to be mounted to said socket, a heat sink member, and a retainer element, said retainer element being adapted to removably retain said heat sink member in a position to remove heat from the electronic device by conduction, said heat sink member having a first surface generally adapted to conform to an exposed mating surface of the electronic device, said heat sink member including a second surface and a plurality of outwardly projecting heat dissipating members arranged on said second surface so as to define therebetween a plurality of first channels extending generally in a first direction and a plurality of second channels extending generally in a second direction, said second direction being approximately perpendicular to said first direction, said retainer element including side panel portions depending form and integral with respective opposite ends of a plurality of mutually parallel relatively narrow spaced apart spring elements, said spring elements being adapted to hold said panel portions in an unassembled configuration and to be received in and extend the length of said first channels, each of said side panel portions having a second latching element adapted to latch with a said first latching element in an assembled configuration;

wherein the improvement comprises:
cross member means integral with and perpendicular to a midportion of each of said spring elements between said panel portions, said cross member means lying substantially in a common plane with said midportions and being adapted to be received in at least one said second channel, whereby the engagement of said cross member in said second channel prevents substantial relative longitudinal movement between said spring elements and said heat sink.

Dependencies are inferred from the claim text.