Multilayer wiring substrate and production thereof
AssigneeHitachi, Ltd.
InventorsHaruhiko Matsuyama, Mitsuo Yoshimoto, Jun Tanaka, Fusaji Shoji, Hitoshi Yokono, Takashi Inoue, Tetsuya Yamazaki, Minoru Tanaka, Hidetaka Shigi
Life of this patent
Estimating the term…
Abstract
A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.
Claims17
A multilayer wiring substrate comprising (1) a ceramic substrate having opposed major surfaces and containing a circuit comprising interlayer wirings in the ceramic substrate and first terminals for at least one of power supply and signal input and output, (2) alternately laminated layers of metal wiring layers and organic insulating layers, formed on at least one of the opposed major surfaces of the ceramic substrate, the organic insulating layers having holes therethrough, the metal wiring layers being electrically connected to each other via the holes through the organic insulating layers, a first portion of at least one of the metal wiring layers being provided beneath an immediately overlying organic insulating layer and a second portion of said at least one of the metal wiring layers being provided beneath a respective hole through the immediately overlying organic insulating layer, each of said at least one of the metal wiring layers having a stabilization treatment layer formed thereon (a) by coating, on said each of said at least one of the metal wiring layers, a metal selected from the group consisting of Cr, Mo, W, Cu, Au and Ni-Cu, the coating being provided between an upper metal wiring layer and a lower metal wiring layer where the upper and lower metal wiring layers are electrically connected to each other, or (b) by dipping in an aqueous solution of water glass, said stabilization treatment layer extending on a respective metal wiring layer both on the first portion of the respective metal wiring layer and on the second portion of the respective metal wiring layer, and (3) a thin film circuit layer having second terminals, for at least one of power supply and signal input and output, to be connected to a large-scale integrated circuit, the thin film circuit layer being formed on a surface of the laminated layers.
A multilayer wiring substrate comprising:
- (1) a ceramic substrate having opposed major surfaces and containing a circuit including interlayer wirings in the ceramic substrate and first terminals for at least one of power supply and signal input and output;
- (2) alternately laminated layers of metal wiring layers and organic insulating layers, formed on at least one of the opposed major surfaces of the ceramic substrate, the organic insulating layers having holes therethrough, the metal wiring layers being electrically connected to each other via the holes through the organic insulating layers, a first portion of at least one of the metal wiring layers being provided beneath an immediately overlying organic insulating layer, and a second portion of said at least one of the metal wiring layers being provided beneath holes through the immediately overlying organic insulating layer, each of the metal wiring layers having been subjected to a stabilization treatment prior to forming the respective immediately overlying organic insulating layer, said stabilization treatment providing a stabilization treatment layer on each of the at least one of the metal wiring layers, including where an immediately overlying metal wiring layer is electrically connected to the respective lower metal wiring layer, such that said metal wiring layers are not corroded by an etchant used to etch a respective immediately overlying organic insulating layer in forming said holes through said immediately overlying organic insulating layer, said stabilization treatment layer extending on a respective metal wiring layer both on the first portion of the respective metal wiring layer and on the second portion of the respective metal wiring layer;
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- (3) a thin film circuit layer having second terminals for at least one of power supply and signal input and output to be connected to a large scale integrated circuit and formed on a surface of the laminated layers.
Dependencies are inferred from the claim text.