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US 5,208,481 AGranted
Lead-frame for manufacturing semiconductor devices
AssigneeRohm Co., Ltd.
InventorsYoshio Kurita, Akira Akamatsu
Life of this patent
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AssigneeRohm Co., Ltd.
InventorsYoshio Kurita, Akira Akamatsu
Estimating the term…
A leadframe facilitates the bonding of leads to semiconductor chips. The leadframe has two longitudinal bands transversely spaced from each other, and connected by bar-like segments initially non-perpendicular to the bands, and spaced longitudinally along the leadframe. The leadframe also includes leads projecting from both of the bands, the leads projecting from one band being interleaved with those projecting from the other band. When one moves the longitudinal bands relative to each other longitudinally, the leads projecting from the first band come into alignment with the leads projecting from the second band. Thus, if one has first bonded semiconductor chips to the ends of the leads projecting from the first band, then movement of the bands longitudinally makes it easy to connect the second leads to each of the semiconductor chips.
A leadframe comprising at least two longitudinal bands which are transversely spaced from each other but connected together by bar-like connecting segments spaced longitudinally of said leadframe, one longitudinal band being formed with a first group of leads spaced longitudinally of said leadframe and extending toward the other longitudinal band, said other longitudinal band being formed with a second group of leads spaced longitudinally of said leadframe and extending toward said one longitudinal band in staggered relation to said first group of leads, wherein each of said connecting segments has a pair of narrower neck portions for stress concentration to allow permanent deformation at said neck portions when said two longitudinal bands are moved relative to each other longitudinally of said leadframe to bring said first group of leads substantially into alignment with said second group of leads transversely of said leadframe.
A leadframe comprising at least two longitudinal bands which are transversely spaced from each other but connected together by bar-like connecting segments spaced longitudinally of said leadframe, one longitudinal band being formed with a first group of leads spaced longitudinally of said leadframe and extending toward the other longitudinal band, said other longitudinal band being formed with a second group of leads spaced longitudinally of said leadframe and extending toward said one longitudinal band in staggered relation to said first group of leads, wherein each of said connecting segments is initially inclined from a line perpendicular to said bands, but becomes substantially perpendicular to said leadframe when said two longitudinal bands are moved relative to each other longitudinally of said leadframe to bring said first group of leads substantially into alignment with said second group of leads transversely of said leadframe.
Dependencies are inferred from the claim text.