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AssigneeKabushiki Kaisha Shinkawa
InventorsMichio Yonemoto, Masayuki Shimura
Estimating the term…
A lead frame transporting device, which uses a pusher to feed a lead frame from a loader onto feeder rails and two optical sensors that are positioned above the both sides of the lead frame. The pusher feeds the lead frame a predetermined distance so that a first detecting point of the lead frame arrives under the sensors and then further feeds the lead frame so that a second detecting point of the lead frame arrives under the sensors. The sensors detects detecting holes of the lead frame at the first and second detecting points so that top or bottom and front or back of the lead frame is detected, so that improperly oriented lead frame is prevented from further being fed to a next step.
A lead frame transporting device comprising, a pusher for feeding out a lead frame from a loader;
Dependencies are inferred from the claim text.
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Apparatus for monitoring, sorting, marking, testing or measuring: position monitoring, e.g. misposition detection or presence detection
Between different workstations: mechanical details, e.g. rollers or belts
Between different workstations: the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
Generic processes or apparatus for the manufacture or treatment of devices covered
Term ended 2 Dec 2011 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
This invention relates to a lead frame transporting device and more particularly to a device that detects top/bottom/front/back orientations of a lead frame that is fed into a die bonder, wire bonder, etc., thus preventing bonding errors.
2. Prior Art
FIG. 1 is a simplified top view showing one embodiment of the present invention;
FIG. 2 is a simplified front view of the area around the loader used in the embodiment of FIG. 1;
FIG. 3 shows the essential portions of the embodiment of the invention wherein FIG. 3(a) is a top view thereof, FIG. 3(b) is a front view, and FIG. 3(c) is a right side view;
In FIG. 1, provided at the left side of feeder rails 1, which transport lead frames 30 by a means that is not shown in the drawings, is a loader 2. Lead frames 30 are stored in this loader 2. Provided at the right side of the feeder rails 1 is an unloader 3 which receives the lead frames 30.
On feeder rails 1, preform station 4 and bonding station 5 are provided along the direction A in which the lead frames are transferred. The preform station 4 is positioned upper stream side relative to the bonding station 5. At the preform station 4 and bonding station 5, a positioning pin (not shown) is inserted into hole 31 (see FIG. 4) to position the lead frame 30. The hole 31 is one of the positioning hole set that consists of holes 30, 31 and 32 and is provided in the lead frame 30.
At preform station 4, adhesive is drip-applied to the lead frame 30 by a preform unit 6, the structure of which is well known. Also, at bonding station 5, die bonding is performed to the lead frame 30 by a bonding head 7, the structure of which is also well known.