Method and apparatus for detecting deformations of leads of semiconductor device

A method of detecting lead deformations in a semiconductor device, comprising:

• a step of illuminating leads of a semiconductor device with a planar light beam;
• a step of picking up images of the leads illuminated with said planar light beam by means of image pick-up means and binary-coding image data of the regions of said leads illuminated with said planar light beam and outputted from said image pick-up means;
• a step of determining the regions of the individual leads illuminated with said planar light beam on the basis of the binary coded image data and determining lines each passing through a center position of each of said regions illuminated with said planar light beam;
• a step of determining statistically weighted average positions in respect to brightness of said regions illuminated with said planar light beams relative to said line;
• a step of approximating the distribution of the statistically weighted average positions of said illuminated regions by a straight line;
• a step of drawing perpendiculars to said statistically weighted average positions, respectively, from said approximate straight line;
• and
• a step of determining distances to said statistically weighted average positions, respectively, from said approximate straight line.

A method of detecting lead deformations in a semiconductor device, comprising:

• a step of illuminating leads of a semiconductor device with a planar light beam;
• a step of picking up images of the leads illuminated with said planar light beam by means of image pick-up means and binary-coding image data of the regions of said leads illuminated with said planar light beam and outputted from said image pick-up means;
• a step of determining regions of the individual leads illuminated with said planar light beam on the basis of the binary coded image data and determining lines each passing through a center position of each of said regions illuminated with said planar light beam;
• a step of determining statistically weighted average positions in respect to brightness of said regions illuminated with said planar light beams relative to said line;
• a step of approximating the distribution of the statistically weighted average positions of said illuminated regions by a straight line;
• a step of drawing perpendiculars to said statistically weighted average positions, respectively, from said approximate straight line;
• and
• a step of determining distances between adjacent ones of said perpendiculars, respectively, to thereby determine magnitude of the vertical deformation of the leads of said semiconductor device.

A method of detecting lead deformations in a semiconductor device, comprising:

• a step of illuminating leads of a semiconductor device with a planar light beam;
• a step of picking up images of the leads illuminated with said planar light beam by means of image pick-up means and binary-coding image data of the regions of said leads illuminated with said planar light beam and outputted from said image pick-up means;
• a step of determining regions of the individual leads illuminated with said planar light beam on the basis of the binary coded image data and determining lines each passing through a center position of each of said regions illuminated with said planar light beam;
• a step of determining statistically weighted average positions in respect to brightness of said regions illuminated with said planar light beams relative to said line;
• a step of approximating the distribution of the statistically weighted average positions of said illuminated regions by a straight line;
• a step of drawing perpendiculars to said statistically weighted average positions, respectively, from said approximate straight line;
• a step of determining distances to said statistically weighted average positions, respectively, from said approximate straight line;
• and
• a step of determining distances between adjacent ones of said perpendiculars, respectively, to thereby determine magnitude of the vertical deformation of the leads of said semiconductor device.

An apparatus for detecting deformation of leads of a semiconductor device, comprising:

• planar light beam generating means for illuminating the leads of the semiconductor device with a planar light beam;
• image pick-up means for picking up images of said leads and for outputting image signals;
• image processing means for receiving and processing said image signals;
• and
• said image processing means being imparted with a function for arithmetically determining statistically weighted average positions of the planar light beam on said individual leads on the basis of said image signals, to thereby detect at least one of vertical and horizontal deformation of said leads on the basis of said statistically weighted average positions.

A method of detecting horizontal and/or vertical deformation of leads of a semiconductor device, comprising the steps of:

• illuminating leads of the semiconductor device with a planar light beam having an optical axis;
• picking up images of regions of said leads illuminated with said planar light beam by means of image pick-up means;
• and
• detecting at least one of the vertical deformation and the horizontal deformation of said leads on the basis of distributed data of said illuminated regions of the individual leads picked up by said image pick-up means;
• wherein, in said illuminating, an angle of an optical axis along which said planar light beam is projected onto soldering surfaces of said leads is selected to be smaller than 90.degree., and wherein, in said detecting, an angle between said optical axis of said planar light beam and that of said image pick-up means is selected to be approximately 90.degree..

An apparatus for detecting deformation of leads of a semiconductor device, comprising:

• planar light beam generating means for illuminating the leads of the semiconductor device with a planar light beam having an optical axis;
• image pick-up means for picking up images of said leads and for outputting image signals;
• and
• image processing means for receiving and processing said image signals;
• wherein the optical axis of said illuminating means is projected onto soldering surfaces of said leads at an angle smaller than 90.degree., and wherein an angle between said optical axis of said planar light beam and that of said image pick-up means is approximately 90.degree..