Resist material and process for use
AssigneesE. I. Du Pont de Nemours and Company, American Telephone and Telegraph Company
InventorsWalter R. Hertler, Dotsevi Y. Sogah, Gary N. Taylor
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Abstract
Excellent resolution and sensitivity in the patterning of resists utilized in device and mask manufacture is obtained with a specific composition. In particular this composition involves polymers having recurring pendant acid labile .alpha.-alkoxyalkyl carboxylic acid ester moieties in the presence of an acid generator activated by actinic radiation such as UV-visible, deep ultraviolet, e-beam and x-ray radiation.
Claims22
A material comprising 1) a polymer chosen from the group consisting of compositions having a polymer backbone and pendant groups bound directly or indirectly to said backbone, said pendant groups represented by the formulae:
- ##STR3## where n is 0-4;
- R.sup.1 is hydrogen or lower alkyl;
- R.sup.2 is lower alkyl;
- and
- R.sup.3 and R.sup.4 independently are hydrogen or lower alkyl where the definition of lower alkyl includes the joining of R.sup.1 and R.sup.2 or R.sup.1 and either R.sup.3 or R.sup.4, or R.sup.2 and either R.sup.3 or R.sup.4 to form a 5-, 6- or 7-membered ring;
- and (2) a material that forms an acid upon irradiation.
A homopolymer of 4-tetrahydropyranyloxbenzyl methacrylate.
A copolymer containing 4-tetrahydropyranyloxybenzyle methacrylate.
Dependencies are inferred from the claim text.