Light-sensitive composition for use as a soldermask and process
AssigneeShipley Company, L.L.C.
InventorsGeorge R. E. Daniels, Michael J. Oddi, Kevin J. Cheetham, Stephen S. Rodriguez
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Abstract
A light sensitive composition and process for using said composition. The light sensitive composition comprises a phenolic resin, a multifunctional epoxy or vinyl compound, a photoinitiator and a thermal crosslinking agent. The process for using the same comprises application of the light sensitive composition to a substrate, drying of the same, exposing the dried coating to activating radiation, partially heat curing the coating, developing the coating and thermally curing the developed image. The composition is especially useful as a solder mask.
Claims11
A method for forming an imaged dielectric layer adhesively bonded to metal conductors of a printed circuit board, said method comprising the steps of coating a photoimageable composition comprising an admixture of a phenolic resin, an acid activated cross linking agent, a cationic photoinitiator and a melamine thermal curing agent on said circuit board;
- exposing at least a portion of said layer of photoimageable composition to activating radiation;
- partially heat curing-said layer;
- developing said layer by contact with an aqueous alkaline developer and thermally curing said layer to crosslink the same.
Dependencies are inferred from the claim text.