Method of forming bipolar transistor having substrate to polysilicon extrinsic base contact
AssigneeMotorola, Inc.
InventorsBradley M. Somero, James D. Hayden
Life of this patent
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AssigneeMotorola, Inc.
InventorsBradley M. Somero, James D. Hayden
Estimating the term…
A bipolar transistor (10) with reduced substrate trenching and reduced base electrode size. A substrate (12) is provided with an overlying first dielectric layer (20), an overlying first conductive layer (24), an overlying second dielectric layer (26), and a doped collector region (14, 16, and 18). An opening is formed within the layers (20, 24, and 26) forming a sidewall of conductive layer (24). A doped base diffusion (28) is formed within a portion of the substrate (12) exposed by the opening. A conductive grown region (30) is formed laterally adjacent the sidewall of conductive layer (24) and overlies substrate (12). A spacer (32) is formed adjacent a first portion of the conductive grown region (30). A second portion of the conductive grown region (30) is removed forming an exposed portion of substrate (12). A second spacer (36) is formed adjacent spacer (32). A conductive layer (38), which forms a doped emitter region is formed overlying the exposed portion of substrate (12).
A process for forming a bipolar transistor comprising the steps of:
A process for forming a bipolar transistor, comprising the steps of:
Dependencies are inferred from the claim text.