Vacuum attraction type substrate holding device
AssigneeCanon Kabushiki Kaisha
InventorMitsuji Marumo
Life of this patent
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Abstract
A vacuum attraction type substrate holding system includes a vacuum source; a distributor for distributing a vacuum from the vacuum source into plural vacuum lines; a plurality of vacuum attraction type substrate holding portions corresponding to the vacuum lines, respectively, each of the substrate holding portions having a valve which is openable and closable for control of the supply of vacuum to the corresponding substrate holding portions, wherein the opening or closing of each valve is influential to control attraction or release of a substrate to or from a corresponding substrate holding portion; and a plurality of restriction valves each being disposed between the distributor and corresponding one of the valves, for serving as a resistance to a gas flowing from the corresponding valve.
Claims21
A vacuum attraction type substrate holding system, comprising:
- a vacuum source;
- a distributor for distributing a vacuum from said vacuum source into a plurality of vacuum lines;
- a plurality of vacuum attraction type substrate holding portions corresponding to said vacuum lines, respectively, each of said substrate holding portions including a three-way valve for control of a supply of one of a vacuum and an ambience pressure to the corresponding substrate holding portions, wherein the control of each valve is influential to control attraction of a substrate to and release of a substrate from a corresponding substrate holding portion;
- and
- a plurality of restriction valves each being disposed between said distributor and a corresponding one of said three-way valves, for resisting gas flowing from the corresponding three-way valve.
A vacuum attraction type substrate holding system, comprising:
- a vacuum source;
- a distributor for distributing a vacuum from said vacuum source into a plurality of vacuum lines;
- a plurality of vacuum attraction type substrate holding portions corresponding to said vacuum lines, respectively, each of said substrate holding portions including a valve which is openable and closable for control of a supply of a vacuum to the corresponding substrate holding portions, wherein the opening and closing of each valve is influential to control attraction of a substrate to and release of a substrate from a corresponding substrate holding portion;
- a plurality of restriction valves each being disposed between said distributor and a corresponding one of said valves, for resisting gas flowing from the corresponding valve;
- and
- a plurality of vacuum sensors each being provided between a corresponding one of said valves and a corresponding one of said substrate holding portions, for detecting the attracting pressure of the corresponding substrate holding portion.
A vacuum attraction type substrate holding method, comprising the steps of:
- providing a plurality of vacuum attraction type substrate holding portions each being coupled to a vacuum source and each having a corresponding valve for control of a vacuum supply thereto from the vacuum source;
- providing restriction means for each substrate holding portion, at a position upstream of the corresponding valve with respect to the vacuum supply direction, for restricting flow of the vacuum supply;
- causing a first substrate holding portion to attract a substrate and then causing a second substrate holding portion to attract the same substrate;
- moving the second substrate holding portion to a predetermined position;
- and
- controlling the restriction of the flow of the vacuum supply by at least one of the restriction means.
A semiconductor device manufacturing method usable with a wafer, said method comprising the steps of:
- providing a plurality of vacuum attraction type wafer holding chucks each being coupled to a vacuum source and each having a corresponding valve for control of a vacuum supply thereto from the vacuum source;
- providing restriction means for each wafer holding chuck, at a position upstream of the corresponding valve with respect to the vacuum supply direction, for restricting flow of the vacuum supply;
- causing a first wafer holding chuck to attract the wafer and then causing a second wafer holding chuck to attract the same wafer;
- moving the second wafer holding chuck to an exposure position;
- and
- controlling the restriction of the flow of the vacuum supply by at least one of the restriction means.
Dependencies are inferred from the claim text.