High temperature baking paste
AssigneeAsahi Kasei Kogyo Kabushiki Kaisha
InventorsAkinori Yokoyama, Tsutomu Katsumata, Hitoshi Nakajima
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Abstract
A composition, which comprises copper alloy powder represented by a general formula Ag.sub.x Cu.sub.y M.sub.z (where M represents one or more metals selected from Pb, Bi and Zn; x, y and z are atomic ratio values, respectively; and 0.001.ltoreq.x.ltoreq.0.4, 0.6.ltoreq.y.ltoreq.0.999, 0.ltoreq.z.ltoreq.0.05 and x+y+z=1) having particle surface silver concentration higher than the average silver concentration thereof and a region in which a silver concentration increases toward the particle surface, glass frit and an organic vehicle, is useful for pastes for screen printing, electroconductive circuits, electrodes, electromagnetic wave shields and an electroconductive pastes for a resistance contacts.
Claims13
A composition, comprising 100 parts by weight of copper alloy powder represented by a general formula Ag.sub.x Cu.sub.y M.sub.z (where 0.001.ltoreq..times..ltoreq.0.4, 0.6.ltoreq.y.ltoreq.0.999, 0.000003 .ltoreq.z.ltoreq.0.05, x+y+z =1;
- where M represents one or more metals selected from the group consisting of Pb, Bi and Zn;
- and x, y and z are atomic ratio values, respectively) particles of which have a particle surface silver concentration higher than the average silver concentration thereof and a region in which a silver concentration increases toward the particle surface, 0.1 to 50 parts by weight of glass frit and an organic vehicle.
Dependencies are inferred from the claim text.