Composite plating film for sliding member
AssigneesDaido Metal Company Ltd., C. Uyemura & Co., Ltd.
InventorsTadashi Tanaka, Masaaki Sakamoto, Motomu Wada, Hideo Ishikawa, Sowjun Matsumura, Tadashi Chiba, Kiyoshi Asakawa, Syoichi Oohora
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Abstract
Disclosed is a composite plating film for sliding members, essentially containing at least one of the alloy elements selected from tin, indium, antimony, and copper; inorganic particles; and lead; the composition of the composite plating film being: a) at least one of the alloy elements selected from tin, indium, antimony, and copper . . . 2 to 30 weight % in total; b) inorganic particles . . . 0.3 to 25 volume %; and c) lead . . . the balance.
Claims6
A composite electroplating film for sliding members, containing at least one alloy element selected from tin, indium, antimony, and copper;
- inorganic particles selected from the nitride, carbide, fluoride and sulfide;
- and lead, wherein the composition of said composite electroplating film consisting essentially of:
- a) at least one of the alloy elements selected from tin, indium, antimony, and copper in amounts of from 2 to 30 weight % in total;
- b) amounts of said inorganic particles in amounts of from 0.3 to 25 volume %;
- and
- c) a balance of lead.
A sliding member comprising:
- a steel backing-metal layer, a bearing copper alloy or aluminum alloy layer, and a surface layer consisting of a composite electroplating film;
- said composite electroplating film containing at least one alloy element selected from tin, indium, antimony, and copper;
- inorganic particles selected from nitride, carbide, fluoride and sulfide and lead;
- wherein the composition of the electroplating film consists of:
- d) at least one of the alloy elements selected from tin, indium, antimony, and copper in amounts of from 2 to 30 weight % in total;
- e) inorganic particles in amounts of from 0.3 to 25 volume %;
- and
- f) a balance of lead.
Dependencies are inferred from the claim text.