Heat dissipation apparatus

An apparatus for dissipating heat from first and second heat generating electronic components which are mounted on a base, each of the components having a planar heat transfer surface, the components being separated from each other by a space, said apparatus comprising:

• p1 means for dissipating heat from the components, said heat dissipation means having first and second planar, thermally conductive walls, and said heat dissipation means being configured such that with said heat dissipation means mounted on the base, said first conductive wall is adjacent to the heat transfer surface of the first component, and said second conductive wall is adjacent to the heat transfer surface of the second component;
• means for pressing the heat transfer surfaces of the first and second components into thermal communication with said first and second conductive walls, said pressing means having first and second contact surfaces and having an adjustment means for adjusting the spacing of said contact surfaces relative to one another;
• said pressing means being configured such that with said first and second contact surfaces positioned within the space said adjustment means can be adjusted such that said first and second surfaces respectively engage the first and second components pressing the heat transfer surfaces of both components into direct thermal communication with said walls;
• and
• clamping means for clamping said heat dissipation means, said clamping means being configured for mounting on said heat dissipation means so that as the heat transfer surfaces of the components are pressed into thermal communication with said conductive walls, thereby applying a force on said conductive walls, said clamping means prevents the relative spacing of said conductive walls from changing.

An apparatus for dissipating heat from first, second and third heat generating electronic components which are mounted on a base, each of the components having a heat transfer surface, the first and second components being separated from each other by a space, said apparatus comprising:

• means for dissipating heat from the components, said heat dissipation means having first and second thermally conductive walls, said heat dissipation means being configured such that with said heat dissipation means mounted on the base, said first conductive wall is adjacent to the heat transfer surface of the first and third component, and said second conductive wall is adjacent to the heat transfer surface of the second component;
• means for pressing the heat transfer surfaces of the first and second components into direct thermal communication with said first and second conductive walls, said pressing means having first and second contact surfaces and having an adjustment means for adjusting the spacing of said contact surfaces relative to one another;
• said pressing means being configured such that with said first and second contact surfaces positioned within the space, said adjustment means can be adjusted such that said first and second contact surfaces respectively engage the first and second components pressing the heat transfer surfaces of both components into thermal communication with said conductive walls;
• and
• clamping means for clamping said heat dissipation means, said clamping means being configured for mounting on said heat dissipatin means so that as the heat transfer surfaces of the components are pressed into contact with said conductive walls, thereby applying a force on said conductive walls, said clamping means prevents the relative spacing of said conductive walls from changing.