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AssigneeGeneral Electric Company
InventorsConstantine A. Neugebauer, Homer H. Glascock, II, Kyung W. Paik, James G. McMullen, Martha M. Neugebauer
Estimating the term…
Annealed copper foil (12) is coated with chromium film (16), followed by coating with an appropriate thickness of gold film (14) and is thermocompression bonded to an aluminum metallized substrate (18) on a silicon chip (30) to provide solderable, high current contacts to the chip. The foil is formed into appropriate electrical network-contact patterns (40) and is bonded to the silicon chip only where aluminum metallization exists on the chip. Leaf (wing) portions (46) of the foil extend beyond the boundaries of the silicon chip for subsequent retroflexing over the foil to provide electrical contact at predesignated locations (49). External contacts to the foil are made by penetrating through a ceramic lid positioned directly above the foil area. Thus, direct thermocompression bonding of a principally copper foil to aluminum semiconductor pads can replace current gold detent/bump connections by securing a copper conductor to a silicon chip through an intermetallic AuAl.sub.2 link and an aluminum stratum.
A metallic laminate bonded to a semiconductor substrate and comprising a first conductive metallic lamina on the substrate, a first bimetal-intermetallic lamina bonded to the first metallic lamina, a second conductive metallic lamina one side of which is bonded to said first bimetal-intermetallic lamina, and a third metallic lamina bonded to the other side of said second metallic lamina, said second metallic lamina thereby separating said third metallic lamina from direct contact with said first bimetal-intermetallic lamina and said first metallic lamina thereby separating said first bimetal-intermetallic lamina from direct contact with the substrate.
A thermocompression-bonded electric power chip assembly comprising a semiconductor chip, a layer of aluminum on said chip, an aluminum-gold intermetallic compound layer on said aluminum layer, a film of chromium on said aluminum-gold intermetallic compound layer, and a copper foil on said chromium film, wherein said film of chromium comprises a coating on at least one side of said copper foil.
Dependencies are inferred from the claim text.