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US 5,180,465 AGranted
Etching method of forming microcircuit patterns on a printed circuit board
AssigneeNippon CMK Corp.
InventorsKameharu Seki, Shin Kawakami, Isamu Kubo
Life of this patent
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Abstract
An etching method of forming circuit patterns on a printed circuit board is disclosed. The etching method comprises step of supplying etching solvent with discharge pressure of substantially 5.about.10 kg/cm.sup.2 and discharge particle diameter of 100.about.200 .mu.m.
Claims6
An etching method of forming circuit patterns on a printed circuit board, comprising:
- supplying etching solvent from a solvent pump at a discharge pressure of substantially 5-10 kg/cm.sup.2 and a discharge particle diameter of 100-200 .mu.m.
A method of forming a circuit pattern on a printed circuit board, comprising:
- supplying etching solvent onto a printed circuit board with a pressure of 5 to 10 kg/cm.sup.2 and a particle diameter of 100 to 200 .mu.m.
Dependencies are inferred from the claim text.