Back to results
US 5,178,986 AGranted
Positive photoresist composition with naphthoquinonediazidesulfonate of oligomeric phenol
AssigneeShipley Company, L.L.C.
InventorsAnthony Zampini, David C. Madoux, Peter Trefonas, III, Charles R. Szmanda
Life of this patent
Estimating the term…
Abstract
A radiation sensitive oligomeric compound is described as the photoactive component with a base soluble phenolic matrix resin to provide improved photo-resist composition having high light-sensitivity, high resolution, excellent developer resistance and excellent resistance to thermal flow.
Claims48
A positive type photoresist composition comprising a mixture of an base-soluble resin and radiation sensitive oligomeric component consisting essentially of a compound of the formula ##STR5## where:
- X is hydrogen or a naphthoquinone-(1,2)-diazide-(2)-sulfonyl residue;
- but at least one X is a naphthoquinone-(1,2)-diazide-(2)-sulfonyl residue;
- R, R.sub.1, R.sub.2 and R.sub.4 are hydrogen, a halogen, an alkyl group free of a tertiary alpha-carbon atom, an alkoxy group having 1 to 4 carbon atoms, an aryl group or an arylalkyl group;
- in addition, R.sub.2 and R.sub.4 may be a nitro or an acyl group having 2 to 4 carbon atoms;
- R.sub.3 is hydrogen, an alkyl, an aryl, or a heterocyclic group, but preferably is H;
- in addition, R.sub.4 may be a tertiary alkyl group;
- wherein the weight ratio of the said resin to said radiation sensitive oligomeric compound is in the range of from about 1:1 to about 10:0.5.
4 more elements
A radiation sensitive oligomeric compound of the formula:
- ##STR6## where:
- X is hydrogen or a naphthoquinone-(1,2)-diazide-(2)sulfonyl residue;
- but at least one X is a naphthoquinone-(1,2)-diazide-(2)-sulfonyl residue;
- R, R.sub.1, R.sub.2 and R.sub.4 are hydrogen, a halogen, an alkyl group free of tertiary alpha-carbon atom, and alkoxy group having 1 to 4 carbon atoms, an aryl group or an arylalkyl group;
- in addition R.sub.2 and R.sub.4 may be a nitro or an acyl group having 2 to 4 carbon atoms;
- R.sub.3 is hydrogen, an alkyl, an aryl, or a heterocyclic group, but preferably is H;
- in addition R.sub.4 may be a tertiary alkyl group, and the weight ratio of the said resin to said radiation sensitive oligomeric component is in the range from about 1:1 to about 10:0.5.
4 more elements
Dependencies are inferred from the claim text.