Conductive ink composition and method of forming a conductive thick film pattern
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSatoru Fujii, Hirotoshi Watanabe
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSatoru Fujii, Hirotoshi Watanabe
Estimating the term…
A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, the vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly.alpha.-methyl styrene.
A conductive ink comprising 78-86 wt % of powder of at least one conductive metal selected from the group consisting of copper, gold and silver;
Dependencies are inferred from the claim text.