Paste compositions
AssigneeJohnson Matthey Public Limited Company
InventorGary P. Shorthouse
Life of this patent
Estimating the term…
Abstract
A thick film dielectric paste for giving fine lines and vias comprises a low permittivity borosilicate or aluminoborosilicate dielectric material of particle size less than 5 .mu.m, together with a medium. The dielectric material sinters at from 600.degree. C. to 1100.degree. C. and is preferably made by sol-gel techniques. Relatively low sintering temperatures can be combined with low permittivity.
Claims9
A thick film paste composition comprising a thick film medium component and a dielectric component of substantially spherical particles of dielectric material having a particle size below 5 .mu.m, and which particles are sinterable at a temperature in the range of 600.degree. C. to 1100.degree. C., said particles of dielectric material being prepared by a sol-gel process, with the proviso that the composition contains neither sodium nor lithium high atomic number elements.
Dependencies are inferred from the claim text.