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US 5,166,656 AGranted
Thin film surface mount fuses
AssigneeAVX Corporation
InventorsAvner Badihi, Robert W. Franklin, Barry N. Breen
Life of this patent
Estimating the term…
Abstract
SMD fuses having consistent operating characteristics are fabricated by forming a repeating lithographic fuse element pattern on an insulative substrate, passivating the structure, bonding a protective glass plate over the passivation layer, slicing the assembly so formed, terminating the slices and cutting the slices into individual fuses. Fuses thus manufactured may be of any desired dimensions, including standard and non-standard chip sizes.
Claims6
A thin film surface mount fuse comprising:
- a generally rectangular, insulating substrate having a top planar surface and opposite end surfaces perpendicular to the top surface;
- a deposited, electrically conductive thin film on the top surface of the substrate, the thin film defining a fuse element comprising a pair of contact portions interconnected by at least one link having a width smaller than that of the contact portions, the link being fusible in response to a predetermined current therethrough, each of the contact portions having an exposed outer edge flush with an end surface of the substrate;
- a passivation layer covering the thin film element;
- an insulating cover coextensive with the substrate and having end surfaces, the insulating cover being bonded by an epoxy layer to the passivation layer, the end surfaces of the substrate and cover and the outer edges of the thin film element defining opposed end faces of the surface mount fuse;
- and
- an electrically conductive termination covering each of the end faces of the fuse and being in electrical contact with the outer edge of one of the contact portions of the fuse element, each termination having a leg extending along a portion of the bottom surface of the substrate and a leg extending along a portion of the top surface of the cover.
3 more elements
Dependencies are inferred from the claim text.