Conductive paste and conductive coating film
AssigneeKao Corporation
InventorsYuzo Yamamoto, Tomoyuki Haishi, Hiromitsu Hayashi, Masaki Iwasaki, Yumi Rakue
Life of this patent
Estimating the term…
Abstract
An electrically conductive paste composition comprises an electric conductive powder, an organic binder comprising (A) a polyhydroxystyrene derivative and (B) a thermosetting resin at a weight ratio of (A) to (B) in the range between 5/95 and 95/5 and a solvent. The paste is used for an electric circuit printed on a substrate and improved in view of migration resistance, flexibility and reliability.
Claims18
A conductive paste comprising an electrically conductive copper powder, an organic binder and a solvent as essential components, characterized in that said organic binder comprises a poly-p-hydroxystyrene represented by the following general formula (I) having a number-average molecular weight of at least 500 and up to 10,000;
- and a thermosetting resin selected from the group consisting of an amino resin and a phenolic resin, and that the amount of the conductive copper powder is 50% by weight to less than 90% by weight based on the total paste constituents excluding the solvent, ##STR17## wherein n is a number of at least 3;
- m is a number satisfying the relationship;
- 0<m.ltoreq.2, l is a number satisfying the relationship:
- 0.ltoreq.l.ltoreq.2;
- Y is a halogen atom, and R.sup.1 to R.sup.3 are each a hydrogen atom or an alkyl group having 1 to 5 carbon atoms and wherein the weight ratio of said poly-p-hydroxystyrene to said thermosetting resin is in the range of between 5/95 to 95/5.
Dependencies are inferred from the claim text.