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US 5,154,301 AGranted
Wafer carrier
AssigneeFluoroware, Inc.
InventorRobert D. Kos
Life of this patent
Estimating the term…
Abstract
A moldable plastic, distortion and warp resistant wafer carrier with forked end wall portions that tie into the sidewalls of the carrier. The forked end wall portions from triangular column like supports between an end wall and sidewalls of the carrier such that the carrier maintains structural integrity even when its temperature fluctuates between ambient and 180.degree. C. temperatures in a relatively short time period. The structural integrity of the carrier is further enhanced by the end wall having an integrally formed bend which is disposed at a right angle relative to the forked end wall portions.
Claims13
A moldable plastic, distortion and warp resistant wafer carrier comprising:
- a) a pair of upright ribbed side frame portions disposed transversely of each other for engaging wafers therebetween and for spacing the wafers apart from each other, each of the side frame portions comprising openings for fluid flow to and from the wafers;
- b) a pair of upright end frame portions disposed between the side frame portions for fixing the side frame portions in a spaced apart relationship;
- and
- c) one of the end frame portions comprising a pair of upright bifurcated end wall portions and an upright intermediate panel portion integrally joined to and between the bifurcated end wall portions, each of the bifurcated end wall portions being integrally joined with one of the side frame portions, each of the bifurcated end wall portions having a pair of end panel portions extending obliquely of one another and extending obliquely of said intermediate panel portion, whereby the resistance of the wafer carrier to warpage is enhanced.
1 more element
A moldable plastic, distortion and warp resistant wafer carrier comprising:
- a) a pair of ribbed side frame portions transversely of each other for engaging wafers therebetween and for spacing the wafers apart from each other, each of the side frame portions comprising openings for fluid flow to and from the wafers;
- b) a pair of end frame portions integrally joined to and between the side frame portions for fixing the side frame portions in a spaced apart relationship;
- and
- c) one of the end frame portions comprising an end wall which comprises:
- 1) a pair of bifurcated end wall portions, each of the bifurcated end wall portions engaging one of the side frame portions;
- 2) a pair of parallel intermediate panel portions one above the other and disposed generally parallel to and offset from each other, one of the parallel intermediate panel portions being disposed at least partially between and engaging the bifurcated end wall portions;
- and
- 3) an intermediate connector panel portion disposed between and engaging the offset intermediate panel portions and extending obliquely relative to the parallel intermediate panel portions whereby resistance of the wafer carrier to warpage is enhanced.
5 more elements
A moldable plastic, distortion and warp resistant wafer carrier comprising:
- a) a pair of ribbed side frame portions disposed transversely of each other for engaging wafers therebetween and for spacing the wafers apart from each other, each of the side frame portions comprising openings for fluid flow to and from the wafers;
- b) a pair of end frame portions integrally joined to and between the side frame portions for fixing the side frame portions in a spaced apart relationship;
- c) a pair of flanges integrally extending outwardly from the side frame portions for being engaged by a handling mechanism, the flanges being disposed adjacent on of the end frame portions;
- d) one of the end frame portions comprising:
- 1) a pair of branched end wall portions, each of the branched end wall portions engaging one of the side frame portions and comprising a pair of end panel portions, one of the end panel portions being greater in length than the other end panel portions, the end panel portions having an equal thickness;
- 2) a pair of parallel intermediate panel portions disposed generally parallel to and offset from each other and being joined to and between at least the longer of the end panel portions, each of the parallel intermediate panel portions extending obliquely relative to the longer of the end panel portions;
- and
- 3) an oblique intermediate panel portion disposed between and engaging the parallel intermediate panel portions and the longer of the end panel portions, the oblique intermediate panel portion extending obliquely relative to the parallel intermediate panel portions and to the longer of the end panel portions whereby resistance of the wafer carrier to warpage is enhanced.
5 more elements
Dependencies are inferred from the claim text.