Mounting of electronic components on substrates
AssigneeMolex Incorporated
InventorTimothy R. Ponn
Life of this patent
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AssigneeMolex Incorporated
InventorTimothy R. Ponn
Estimating the term…
A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360.degree. thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360.degree. slot is formed in the substrate. One conductive side of the electronic component is in electrical connection with the conductive material on the substrate within the closed slot, and the other conductive side of the electronic component is in electrical connection with the conductive material on the substrate outside the closed slot. A terminal is electrically connected to the conductive material on the substrate inside the closed slot.
A method for mounting electronic components such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of:
The method of claim 8, including connecting the terminal to the opposite end of the electronic component by means of a conductive adhesive.
A method for mounting electronic component, such as capacitors having first and second conductive surfaces, to a flat insulating substrate, comprising the steps of:
A method for mounting electronic components, such as capacitors having first and second conductive sides, to a flat flexible insulating substrate having conductive material thereon, comprising the steps of:
The method of claim of 15 wherein said one conductive side of the electronic component is attached to the tongue by applying a conductive adhesive between the conductive material thereon and the one conductive side of the electronic component.
An electrical device, comprising:
A method for mounting electronic components, such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of:
A method for mounting electronic components such as capacitors having two conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of:
A method for mounting electronic components, such as capacitors having two opposite conductive sides, to a flat insulating substrate having conductive material thereon, comprising the steps of:
An electrical device, comprising:
Dependencies are inferred from the claim text.