High-temperature adhesive compositions
AssigneeLord Corporation
InventorsPatrick A. Warren, Mark A. Weih, Karen M. Bond
Life of this patent
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Abstract
A one-coat adhesive composition which utilizes environmentally acceptable ingredients and which can withstand high temperature conditions such as those experienced during injection molding processes. The adhesive contains a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent, a phenolic resin, an aromatic hydroxy compound, a formaldehyde donor, a heat-activated unsaturated elastomer crosslinker, a vulcanizing agent, and a metal oxide. An adhesive bond prepared with the adhesive is resistant to high temperature fluids and corrosive agents.
Claims29
An adhesive composition comprising:
- a) a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent;
- b) a phenolic resin;
- c) an aromatic hydroxy compound;
- d) a formaldehyde donor;
- e) a heat-activated unsaturated elastomer crosslinker;
- f) a vulcanizing agent;
- and
- g) a metal oxide.
An adhesive composition comprising from about 35 to 75 percent by dry weight of a Diels-Alder adduct of a perhalogenated cyclic conjugated diene and an olefinically unsaturated dienophile having a vinyl content in excess of 50 percent, from about 1 to 15 percent by dry weight of a phenolic resin, from about 1 to 15 percent by dry weight of an aromatic hydroxy compound, from about 1 to 15 percent by dry weight of a formaldehyde donor, from about 0.1 to 15 percent by dry weight of a heatactivated unsaturated elastomer crosslinker, from about 1 to 15 percent by dry weight of a vulcanizing agent, and from about 1 to 60 percent by dry weight of a metal oxide.
Dependencies are inferred from the claim text.