Direct patterning of metals over a thermally inefficient surface using a laser
AssigneeGeneral Electric Company
InventorsRobert J. Wojnarowski, Charles W. Eichelberger
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AssigneeGeneral Electric Company
InventorsRobert J. Wojnarowski, Charles W. Eichelberger
Estimating the term…
Conductive patterns may be formed on the surface of thermally inefficient substrates by depositing a uniform layer of metal thereover whose upper surface is substantially UV light absorbing followed by laser ablation of the deposited metal to leave the deposited metal only in the desired metal pattern. Thermally efficient substrates may be rendered thermally inefficient by the deposition of a thermally inefficient material thereon. That thermally inefficient material may be either electrically insulating or a metal. A two layer metallization comprising a first, thermally inefficient reactive metal and a second UV light absorbing metal is preferred. When disposed on a thermally inefficient substrate, this two layer metallization ablates reactively as the two layers burn off together. This laser ablation process substantially roughens the surface of polymer dielectrics and may be used to repair open traces in printed circuit structures.
A method of producing a desired metal pattern on a surface of a thermally inefficient substrate comprising:
A method of increasing the surface area of a polymer comprising:
A method of repairing a broken trace in a printed circuit comprising:
A method of trimming a resistor comprising:
A method of producing a metal pattern on a surface of a high thermal conductivity substrate comprising:
A method of producing a metal pattern on a surface of a high thermal conductivity substrate comprising:
Dependencies are inferred from the claim text.