Thick film low-end resistor composition
AssigneeE. I. Du Pont de Nemours and Company
InventorLyle H. Slack
Life of this patent
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Abstract
A thick film low-end resistor composition comprising an admixture of finely divided particles of (a) silver, palladium, an alloy of palladium and silver, or mixtures thereof; (b) an admixture of (1) glass having a softening point of 350.degree. to 500.degree. C., which when molten is wetting with respect to the other solids in the composition, and (2) glass having a softening point of 550.degree. to 650.degree. C.; and (c) 5-20% by volume, basis total solids, of sub-micron particles of RuO.sub.2, all of (a) through (c) being dispersed in (d) an organic medium.
Claims9
A thick film composition for the preparation of fired resistors having a resistance of less than 100 ohms per square comprising an admixture of finely divided particles of:
- (a) silver, palladium, an alloy of palladium and silver or mixtures thereof, in which the weight ratio of palladium to silver is from 32:68 to 58:42;
- (b) 40-80% by volume, basis total particulate solids in the composition, of an admixture of (1) 0.2 to 5.0% by weight, basis total solids, of a non-crystallizing glass having a softening point of 350.degree. to 500.degree. C., which when molten is wetting with respect to the other solids in the composition, and (2) a glass having softening point of 550.degree. to 650.degree. C.;
- and
- (c) 5-20% by volume, basis total particulate solids in the composition of uncoated sub-micron particles of RuO.sub.2, all of (a) through (c) being dispersed in
- (d) an organic medium.
Dependencies are inferred from the claim text.