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AssigneeHitachi, Ltd.
InventorsToshio Hatada, Takayuki Atarashi, Takahiro Daikoku, Satomi Kobayashi, Shizuo Zushi, Fumiyuki Kobayashi, Susumu Iwai
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A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.
A cooling system comprising a cooling fluid flow passage having an upstream end and a downstream end in which heat-generating components of an electronic device arranged in series along a major cooling fluid flow path of said cooling fluid flow passage are disposed for cooling said electronic device by allowing a cooling fluid to flow from the upstream end of said flow passage to the downstream end of said flow passage along the major cooling fluid flow path in contact with said heat-generating components, wherein:
A cooling system comprising a cooling fluid flow passage having an upstream end and a downstream end in which a series of assemblies composed of heat-generating components of an electronic device arranged in series along a major cooling fluid flow path of said cooling fluid flow passage and heat radiation members connected to said heat-generating components are disposed for cooling said electronic device by allowing a cooling fluid to flow from the upstream end of said flow passage to the downstream end of said flow passage along the major cooling fluid flow path in contact with said heat-generating components, wherein:
A cooling system comprising a cooling fluid flow passage having an upstream end and a downstream end in which a series of assemblies composed of heat-generating components of an electronic device arranged in series along a major cooling fluid flow path of said cooling fluid flow passage and heat radiation members connected to said heat-generating components are disposed for cooling said electronic device by allowing a cooling fluid to flow from the upstream end of said flow passage to the downstream end of said flow passage in contact with said heat-generating components, wherein:
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Involving heat exchange by flowing fluids: by flowing gases, e.g. forced air cooling
Generic packages, interconnections, connectors or other constructional details of devices covered by
Term ended 7 Sep 2009 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
The present invention relates to a cooling system for cooling an electronic device such as a computer having components which generate heat during operation.
2. Description of the Related Art
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a graph illustrative of temperature distribution characteristics as obtained by a known cooling system;
FIG. 3 is a graph illustrative of temperature distribution characteristics as obtained by a cooling system in accordance with the present invention;
Preferred embodiments of the invention will be described with reference to the accompanying drawings.
FIG. 1 illustrates a first embodiment of the cooling system in accordance with the present invention. The cooling system has cooling ducts (cooling passages) 1a, 1b and 1c connected in series to provide a passage for a cooling fluid such as air.
More specifically, the cooling duct la is capable of introducing cooling air supplied by, for example, a blower to heat sources 2a, 2b such as LSIs. The duct 1a has a height greater than the height of fins 3a provided on the upstream heat source 2a. The heat radiation fins 3 are tabular fins arranged in parallel with one another and extending in the direction of flow of the cooling air. The duct 1b has a tapered top wall which extends from the downstream end of the duct 1a substantially above the downstream end of the heat source 2a to the downstream end of fins 3b provided on the downstream heat source 2b. The duct 1c is connected to the downstream end of the duct 1b and leads to a cooling air discharge opening. In this embodiment, two heat sources 2a and 2b carrying respective fins 3a and 3b are arranged in series in the direction of flow of the cooling air, and the cooling air passage is formed by the series connection of the ducts 1a, 1b and 1c which are constructed such that the cross-sectional area of the air passage formed by these ducts, i.e., the area of plane perpendicular to the direction of flow of the cooling air, progressively decreases towards the downstream end of the cooling air passage.