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US 5,043,244 AGranted
Process for defined etching of substrates
AssigneeE. I. Du Pont de Nemours and Company
InventorsAllan Cairncross, Chester A. Thayer, II
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Abstract
A process is described for defined etching of holes using a sliver mask formed by silver diffusion transfer imaging.
Claims27
A process for making a pattern of one or more etched features in a substrate which comprises the steps:
- (a) applying diffusion transfer nuclei to a surface portion of the substrate,
- (b) applying a silver halide containing photosensitive material either as a layer on the substrate overlying the diffusion transfer nuclei or as a layer on a second substrate,
- (c) exposing the photosensitive material to actinic radiation in a pattern corresponding to the desired etch pattern,
- (d) applying developer solution to material exposed in Step (c),
- (e) forming a pattern of silver as a coating on the substrate by silver diffusion transfer wherein the pattern has no developed silver in the areas to be etched,
- (f) removing the layer that originally contained the silver halide material while leaving the pattern of silver formed in Step (e) on the surface of the substrate, and
- (g) applying an etching treatment to remove the substrate in the areas not covered by silver thereby forming an etched pattern.
4 more elements
Dependencies are inferred from the claim text.