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US 5,021,924 AGranted
Semiconductor cooling device
AssigneeHitachi, Ltd.
InventorsShigekazu Kieda, Tadakatsu Nakajima, Heikichi Kuwahara, Motohiro Sato
Life of this patent
Estimating the term…
Abstract
A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.
Claims21
A semiconductor cooling device comprising:
- a plurality of semiconductor integrated circuits mounted on a module substrate;
- a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits;
- and
- liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said liquid nozzles emit and direct jets of a cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits.
1 more element
A semiconductor cooling device comprising:
- a plurality of semiconductor integrated circuits mounted on a module substrate;
- a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits;
- and
- liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said individual integrated circuits, wherein said cooling liquid nozzles emit and direct cooling liquid jets at a slant to back wall surface of the individual integrated circuits.
1 more element
A semiconductor cooling device comprising:
- a plurality of semiconductor integrated circuits mounted on a module substrate;
- a sealing member attached to said module substrate and forming a housing enclosing said plurality of integrated circuits;
- cooling liquid supplying means provided on said sealing member and having a plurality of cooling liquid nozzles respectively associated with each of said integrated circuits, said cooling liquid nozzles emitting and directing jets of cooling liquid in a direction substantially parallel to a back wall surface of the respective integrated circuits;
- a cooling liquid introducing path provided on said sealing member to introduce the cooling liquid to be supplied to said cooling liquid nozzles;
- and
- a cooling liquid discharge path provided independently of said cooling liquid introducing path to guide the cooling liquid after having cooled the integrated circuits to an exterior of said housing.
3 more elements
A semiconductor cooling device comprising:
- a plurality of semiconductor integrated circuits mounted on a module substrate;
- a sealing cap connected to said module substrate and sealing the plurality of integrated circuits from the exterior of the device;
- a plenum between said sealing cap and said module substrate;
- a cooling liquid accommodated in said plenum;
- a header formed in said cap to guide the cooling liquid;
- cooling liquid supplying means including a plurality of cooling liquid nozzles which directly emit the cooling liquid to each of said integrated circuits, each of said cooling liquid nozzles emitting and directing a jet of the cooling liquid in a direction substantially in parallel with a back wall surface of the individual integrated circuits;
- and
- a cooling liquid discharge port for discharging the cooling liquid to the exterior of the device after the liquid cooling passes said cap to cool the integrated circuits;
- wherein said cooling liquid supplying means has liquid nozzles for emitting the cooling liquid in parallel with the back surface of each of the integrated circuits.
6 more elements
Dependencies are inferred from the claim text.