High density connector for an IC chip carrier
AssigneeAMP Incorporated
InventorDimitry G. Grabbe
Life of this patent
Estimating the term…
Abstract
The present invention is an interposer connector assembly having a small contact grid spacing for interconnecting a relatively large integrated circuit chip carrier with a printed circuit board. The interposer connector assembly includes a holder which is composed of several thin plates having perforations arranged on the desired grid patterns. The thin plates are stacked with their perforations in alignment to form through openings in the holder. Contact modules are then inserted into the through openings to complete the connector assembly. The contact modules comprise a two part plastic housing with a contact member contained in a cavity formed by mating the two parts. The two parts are formed on continuous strips of extruded plastic.
Claims10
A connector assembly for electrically connecting contact pads arranged in a first pattern on a surface of a first substrate to respective contact pads arranged in a second pattern on a surface of a second substrate comprising;
- (a) a plurality of substantially identical contact modules, each of which includes an insulating body and a contact member having a resilient portion and first and second contact portions disposed at opposite ends of said resilient portion, each insulating body being of dielectric material and including a first part and a second part each of which have matable features including a portion of a cavity so that when said first and second parts are brought into engagement to form said body, said matable features interengage mutually aligning said parts to form an interior cavity containing said resilient portion of said contact member, wherein said first and second contact portions extend through openings in opposite sides of said insulating body;
- and
- (b) a holder having first and second parallel major planar surfaces, said holder having a plurality of openings for receiving said plurality of contact modules and spacing them so that all of said first and second contact portions extend outwardly from said first and second planar surfaces respectively and are in alignment with said first and second patterns of said contact pads on said first and second substrates respectively;
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- (c) means for holding said first and second substrates and said holder so that said first and second contact portions of some of said contact members are in contacting engagement with their respective contact pads on said first and second substrates.
Dependencies are inferred from the claim text.