Electronic component carrier

Abstract

An electronic component carrier includes an elongated substrate having a series of electronic component-setting portions spaced from one another at a predetermined interval along the length of the substrate. The substrate has push bar-insertion holes formed therethrough and disposed respectively at the electronic component-setting portions. Adhesive layers are formed respectively on surfaces of the electronic component-setting portions. The electronic components are adapted to be bonded respectively to the electronic component-setting portions through the adhesive layers. A push bar is adapted to be inserted into the push bar-insertion hole so as to be engaged with the electronic component to release the same from the adhesive layer.

Dependencies are inferred from the claim text.