Cooling apparatus and semiconductor device employing the same

A semiconductor device comprising:

• at least one semiconductor chip having a cooling surface and mounted on a ceramic multi-layer printed circuit board;
• a housing cooled by a coolant;
• a heat transfer block kept in contact with said housing, said heat transfer block having a recess confined by at least one inclined surface;
• and
• at least one heat conducting member kept in contact with said semiconductor chip and said heat transfer block;
• said at least one heat conducting member having at least one inclined surface which in inclined with respect to said cooling surface of said semiconductor chip, said at least one heat conducting member being capable of sliding an/or rotating while being kept in contact with said heat transfer block so that, even if said semiconductor chip is displaced in any direction or inclined at any angle with respect to said heat transfer block, the whole of said cooling surface of said semiconductor ship can be maintained in contact with said contact surface of said at least one heat conducting member, said at least one inclined surface of the at least one heat conducting member being curved so as to form a line contact.

A mounting structure for mounting a semiconductor device combined with a cooling apparatus onto a computer, comprising:

• a ceramic multi-layer printed circuit board for carrying a plurality of semiconductor chips each having a cooling surface;
• a multi-layer printed circuit board electrically connected to said plurality of semiconductor chips through pins provided on said semiconductor chips;
• a backboard electrically connected to said multi-layer printed circuit board through multi-core connectors;
• a housing cooled by a coolant fixed to said ceramic multi-layer printed circuit board;
• a heat transfer block kept in contact with said housing, said block having a recess confined by at least one inclined surface;
• and
• at least one heat conducting member kept in contact with said semiconductor chip and said heat transfer block;
• said at least one heat conducting member having at least one inclined surface which is inclined with respect to said cooling surface of said semiconductor chip, said at least one heat conducting member being capable of sliding and/or rotating while being kept in contact with said heat transfer block so that, even if said semiconductor chip is displaced in any direction or inclined at any angle with respect to said heat transfer block, the whole of said cooling surface of said semiconductor chip can be maintained in contact with said contact surface of said at least one heat conducting member, said at least one inclined surface of the at least one heat conducting member being curved so as to form a line contact.