US 4,907,061 AGranted

Electronic device

AssigneeMitsubishi Denki Kabushiki Kaisha

InventorMasanobu Kohara

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Abstract

The electronic device relating to the invention is that in which an electrode is formed on the rear side surface of a semiconductor element, a circuit wiring and an external electrode connected electrically to one end of the circuit wiring are formed on the rear side surface of a flexible insulating film with a first opening provided therefor, a lead terminal overhanging to the first opening is connected electrically to the other end of the circuit wiring, a second opening is formed on the flexible insulating film so as to expose a part of the external electrode, a package substrate is constituted of the flexible insulating film in tape assembly system, the circuit wiring, the external electrode and the lead terminal, the semiconductor element is disposed on the rear side surface side of the flexible insulating film under the first opening and the lead terminal is connected electrically and mechanically thereto, a part or the whole of the semiconductor element, the electrode, the lead terminal, a part of the circuit wiring and the first opening are sealed with a sealing resin, a semiconductor device is constituted of the semiconductor element, the electrode, the package substrate and the sealing resin, the semiconductor device is mounted in a recession formed on the front side of a thin flexible substrate like IC card so as to make the front side surface of the flexible insulating film coincide with the front side surface of the thin flexible substrate.

Claims5

Dependent claims

An electronic device, comprising:

a semiconductor element having a front side surface and a rear side surface;
a flexible insulating film having a front side surface and a rear side surface;
an electrode formed on said front side surface of said semiconductor element;
a circuit wiring, and an external electrode connected electrically to one end of the circuit wiring, both formed on said rear side surface of said flexible insulating film;
said flexible insulating film being provided with a first opening;
a lead terminal connected electrically to the other end of said circuit wiring and overhanging said first opening;
said flexible insulating film being provided with a second opening exposing a part of said external electrode;
said flexible insulating film, circuit wiring, external electrode and lead terminal constituting a package substrate;
said semiconductor element being disposed on said rear side surface of said flexible insulating film under said first opening, said lead terminal being connected electrically and mechanically to said electrode formed on said front side surface of said semiconductor element
a sealing resin sealing at least a part of said semiconductor element, said external electrode, said lead terminal, a part of said circuit wiring and said first opening;
said semiconductor element, said external electrode, said package substrate, and said sealing resin constituting a semiconductor device;
a thin flexible substrate;
said thin flexible substrate being provided with a recess, on its front side;
said semiconductor device being mounted in said recess with the front side surface of said flexible insulating film coincident with the front side surface of said thin flexible substrate.

11 more elements

Dependencies are inferred from the claim text.