Copper conductor composition
AssigneesDai-Ichi Kogyo Seiyaku Co., Ltd., Dowa Mining Co., Ltd., Matsushita Electric Industrial Co., Ltd.
InventorsMasatoshi Suehiro, Masashi Echigo, Masami Sakuraba, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura
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Abstract
A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
Claims1
A copper conductor composition comprising 70 to 90% by weight, based on the weight of the composition of copper powder 0.1 to 10% by weight, based on the weight of the composition of an inorganic binder 8 to 20% by weight, based on the weight of the composition of an organic medium, and at least one of (a) 0.01 to 1% by weight, based on the weight of the composition, of a metal boride selected from the group consisting of tungsten boride, molybdenum boride, titanium boride, tantalum boride, niobium boride, chromium boride and solid solutions thereof, and (b) 0.01 to 3% by weight, based on the weight of the composition, of a metal silicide selected from the group consisting of tungsten silicide, molybdenum silicide, titanium silicide, tantalum silicide, niobium silicide, chromium silicide, and solid solutions thereof.
Dependencies are inferred from the claim text.