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US 4,906,162 AGranted
Method for handling semiconductor components
AssigneeMotorola, Inc.
InventorsKenneth J. Long, Bobby W. Formby
Life of this patent
Estimating the term…
Abstract
A method for handling semiconductor components by utilizing a removable filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the components against the top, bottom or side of the tube. Partial removal of the filler strip will result in the dispensing of some of the components while the remainder are retained by the filler strip in the tube.
Claims12
A method for handling semiconductor components comprising the following steps:
- providing a tube having at least first and second walls and two open ends, said tube capable of longitudinally containing a plurality of semiconductor components;
- providing a removable filler strip comprising a flat, elongated, body sufficiently thin to fit between said components and said first wall and having at least one surface feature protruding from said strip;
- filling said tube with said plurality of semiconductor components;
- and
- fitting said strip between said components and said first wall such that said components are secured against said second wall by said filler strip.
2 more elements
Dependencies are inferred from the claim text.