Process for imaging multi-layer resist structure

A process for providing an image which comprises:

• depositing on a substrate a first layer of a positive photoresist comprising a phenolicformaldehyde novolak type polymer with a diazosensitizer and a compound selected from the group of imidazoles, benzimidzoles, triazoles, and indazoles, and mixtures thereof in an amount sufficient to increase the solubility of the layer in aqueous alkaline developer after exposure to imaging radiation;
• depositing on said first layer a second and different layer of a positive photoresist comprising a phenolic-formaldehyde novolak type polymer with a diazo-sensitizer wherein said second layer has a lower degree of solubility than said first layer in aqueous alkaline developer after exposure to imaging radiation;
• exposing said first layer of positive photoresist and said second layer of positive photoresist to imaging radiation in a predetermined pattern;
• and
• developing said first layer of positive photoresist and said second layer of positive photoresist to thereby remove the portions of said first layer and said second layer that were exposed to said imaging radiation.