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US 4,904,497 AGranted
Electromagnetic solder tinning method
AssigneeOlin Corporation
InventorBrian G. Lewis
Life of this patent
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Abstract
The present invention relates to an electromagnetic system for applying a coating to a metal or metal alloy substrate. The system utilizes a high frequency electromagnetic field to maintain a supply of coating material in a molten condition, to restrict the flow of the molten coating material, and to control the thickness of the applied coating layer. Downstream cooling solidifies the coating layer. The system has particular utility in forming tin coated copper or copper base alloy products.
Claims9
A process for applying a coating material having a desired thickness to at least one surface of a substrate, said process comprising:
- providing a container having an inlet and an outlet and a supply of coating material within said container;
- passing a substrate to be coated through said inlet into contact with said coating material;
- providing an inductor adjacent to the outlet of said container;
- and
- supplying a time varying current at a desired frequency to said conductor to create magnetic forces for restricting the flow of said coating material through said outlet and for controlling the thickness of said coating material applied to said substrate.
2 more elements
Dependencies are inferred from the claim text.