Suction device
AssigneeSumitomo Electric Industries, Ltd.
InventorsMasanori Nishiguchi, Takeshi Sekiguchi
Life of this patent
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Abstract
Suction device for handling a semiconductor wafer comprises a handling section having a plurality of suction ports opened in the same plane as the surface of the wafer and located within an area smaller than that of the surface of the wafer, a pressure reduction device connected to the suction port, an opening acts to release negative pressure produced by the pressure reduction device when a finger is released therefrom, and a grip integrally coupled to the handling section.
Claims5
A suction device for handling a semiconductor wafer having a surface including a central processed region and a peripheral unprocessed region, said suction device comprising:
- a handling section having upper and lower surfaces, a plurality of suction ports defined through said lower surface about an outer periphery of said lower surface so as to define a substantially arc-shaped suction port configuration, said handling section being sized and said suction ports being disposed so that when said lower surface of said handling section is placed in facing relation to and in operative contact with a surface of a semiconductor wafer, said suction ports are in facing relation to an unprocessed peripheral portion of the wafer and said handling section is free from operative contact with a processed portion of the semiconductor wafer;
- a pressure reduction means operatively coupled to said suction ports for producing a negative pressure;
- means for releasing said negative pressure produced by said pressure reduction means;
- and
- a grip element coupled to said handling section.
Dependencies are inferred from the claim text.