Method for inserting chip parts into a holding plate

An insertion method for inserting chip parts into through holes in a holding plate having a plurality of such through holes therein surrounded by elastic material for resiliently holding the chip parts in the respective through holes, said insertion method comprising:

• providing a generally plate-shaped member having a plurality of individual through bores therein each separate from the other through bores and at positions corresponding to the positions of the through holes in the holding plate, each of said through bores having a larger portion with an outer end communicating with one surface of said member and having a cross-sectional size sufficiently large to hold one of the chip parts, and a smaller bore portion extending from the inner end of said larger bore portion to the other surface of said member and having a cross-sectional size smaller than the cross-sectional size of the chip parts;
• positioning said insertion apparatus with said one surface disposed upwardly and placing chip parts in said larger bore portions of said through bores, respectively;
• superposing said holding plate on said one surface of said insertion apparatus with the through holes aligned with said through bores in said insertion apparatus;
• and
• then moving pins and the superposed holding plate and insertion apparatus relative to each other to cause said pins to move relatively into said through bores in said insertion apparatus from said smaller bore portion end to insert said chip parts into the respective through bores in said holding plate.