Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof

In a shielded high-frequency apparatus comprising a frame formed of metal plate, a plurality of partition plates for partitioning the interior of said frame, said partition plates being respectively formed of metal plate arranged to mutually intersect perpendicularly along at least one specific axis, and a printed circuit board mounted within said frame, the improvement comprising:

• a solder resist film provided over at least an interior surface of said frame, and over respective surfaces of said partition plates, with said solder resist film being omitted from specific end regions of said partition plates, said specific end regions being disposed immediately adjacent to said frame interior surface, and being omitted from surface regions of said partition plates disposed immediately adjacent to said at least one specific axis, said solder resist film being further omitted from specific regions of said frame interior surface which are positioned in correspondence with said specific end regions of said partition plates;
• and
• solder portions respectively provided on said specific end regions of said partition plates and said correspondingly positioned specific regions of said frame interior surface, for thereby attaching said partition plates to said interior surface, and solder portions provided on said surface regions of said partition plates adjacent said at least one specific axis for thereby mutually attaching said partition plates.

In a shielded high-frequency apparatus comprising a frame formed of metal plate, a plurality of partition plates, respectively formed of metal plate, for partitioning the interior of said frame, and a printed circuit board mounted within said frame and having a ground pattern formed as a patterned metal layer thereon, the improvement comprising:

• a solder resist film provided over at least an interior surface of said frame, and over respective surfaces of said partition plates, with said solder resist film being omitted from specific end regions of said partition plates, said specific end regions being disposed immediately adjacent to said frame interior surface, said solder resist film being further omitted from specific regions of said frame interior surface which are positioned in correspondence with said specific end regions of said partition plates, said solder resist film being omitted from specific regions of said printed circuit board ground pattern disposed adjacent to the periphery of said printed circuit board and also omitted from specific regions of said frame interior surface positioned respectively corresponding and adjacent to said specific regions of the printed circuit board ground pattern;
• and
• solder portions respectively provided on said specific end regions of said partition plates and said correspondingly positioned specific regions of said frame interior surface, for thereby attaching said partition plates to said interior surface, and solder portions respectively provided on said printed circuit board ground pattern specific regions and on said corresponding specific regions of said frame internal surface, for thereby attaching said printed circuit board to said frame.

A method of manufacturing a shielded high-frequency apparatus having a partitioned shielding case and a printed circuit board mounted within said partitioned shielding case, comprising steps of:

• (a) forming a frame and partition plates from plate metal;
• (b) forming a solder resist film over an interior surface of said frame, with said solder resist film being omitted from a plurality of specific regions of said frame interior surface, and forming a solder resist film over surfaces of said partition plates, with said solder resist film being omitted from specific end regions of said partition plates;
• (c) mounting said partition plates within said frame, with said end regions of said partition plates positioned immediately adjacent to respective ones of said specific regions of said frame interior surface;
• and
• (d) forming solder over said specific end regions of the partition plates and said specific regions of said frame interior surface, for thereby attaching said partition plates to said frame interior surface to thereby form said partitioned shielding case.

A method of manufacturing a shielded high-frequency apparatus having a partitioned shielding case and a printed circuit board mounted within said partitioned shielding case, comprising steps of:

• (a) forming a frame and at least two partition plates from plate metal;
• (b) forming solder resist film over an interior surface of said frame, with said solder resist film being omitted from a plurality of specific regions of said frame interior surface, and forming a solder resist film over surfaces of said partition plates, with said solder resist film being omitted from specific end regions of said partition plates and from specific intermediate regions of said partition plates adjacent to at least an intersection axis where said partition plates mutually intersect perpendicularly;
• (c) mounting said partition plates to mutually intersect perpendicularly within said frame, with said specific end regions of said partition plates being positioned immediately adjacent to respective ones of said specific regions of said frame interior surface;
• and
• (d) forming solder over said specific end regions of said partition plates and said specific regions of said frame interior surface, for thereby attaching said partition plates to said frame interior surface, and forming solder over said intermediate regions of said partition plates to thereby mutually attach said partition plates.

A method of manufacturing a shielded high-frequency apparatus having a partitioned shielding case and a printed circuit board mounted within said partitioned shielding case, comprising steps of:

• (a) forming a frame and partition plates from plate metal;
• (b) forming a solder resist film over surfaces of said partition plates, with said solder resist film being omitted from specific end regions of said partition plates, forming a solder resist film over at least one ground pattern of said printed circuit board, with said solder resist film being omitted from specific regions of said one ground pattern which are positioned immediately adjacent to the periphery of said printed circuit board, and forming a solder resist film over an interior surface of said frame, with said solder resist film being omitted from a plurality of specific regions of said frame interior surface which are respectively disposed immediately adjacent to said specific end regions of said partition plates and said specific periphery regions of said printed circuit board when said partition plates and printed circuit board are mounted within said frame;
• (c) mounting said partition plates within said frame, with said end regions of said partition plates positioned immediately adjacent to respective ones of said specific regions of said frame interior surface;
• (d) forming solder over said specific end regions of said partition plates and said specific regions of said frame interior surface corresponding thereto, for thereby attaching said partition plates to said frame interior surface to thereby form said partitioned shielding case;
• and
• (e) placing said printed circuit board within said partitioned shielding case at a predetermined position, and forming solder over said specific periphery regions of said printed circuit board ground pattern and said specific regions of said frame interior surface corresponding thereto, for thereby attaching said printed circuit board to said partitioned shielding case.