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US 4,903,119 AGranted
Semi-conductor device
AssigneeNitto Electric Industrial Co., Ltd.
InventorsSatoshi Ito, Akiko Kitayama, Takatoshi Hamada, Miho Yamaguchi
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Abstract
A semi-conductor device in which a semi-conductor element is sealed with a molding resin is disclosed. In the device, adhesion between a semi-conductor chip and the molding resin is achieved mainly by oxygen-crosslinking between silicon in the semi-conductor chip and silicon in the molding resin. The device exhibits excellent moisture-resistant reliability even after mounting.
Claims3
A semi-conductor device comprising a semi-conductor element sealed with a molding resin, wherein
- said molding resin is a cured epoxy resin composition comprising an epoxy resin, a curing agent which is a phenolic resin modified by preliminary reaction with a silane compound, and an inorganic filler, and
- adhesion between a semi-conductor chip in the semi-conductor device and said molding resin is achieved mainly by oxygen-crosslinking between silicon in said semi-conductor chip and silicon in said molding resin.
Dependencies are inferred from the claim text.