Method of manufacturing conductive electrodes for a circuit element, and semiconductor device thus obtained
AssigneeU.S. Philips Corporation
InventorsStefan Barbu, Claude E. Chapron
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Abstract
The invention relates to semiconductor devices comprising logic, or low-noise, transistors, or transistors for very high frequencies whose structure is improved with respect to the dimensions, the series resistance value, and/or the gain. Such semiconductor devices may be integrated into a semiconductor body having surfaces with contact windows covered with layers of metal combined with the material of the semiconductor body. A multi-collector transistor structure is also formed.
Claims3
A semiconductor device for a very high frequency transistor comprising a semiconductor body having a surface;
- an insulating layer disposed on said surface;
- at least two adjacent contact windows disposed in said insulating layer and extending to said surface;
- a narrow region of said insulating layer separating said adjacent contact windows, said narrow region having a dimensions E between said contact windows;
- a layer of a metal chemically combined with said semiconductor body within said contact windows, said layer entirely covering said surface within said contact windows;
- a base electrode disposed over said layer in one of said contact windows;
- an emitter electrode disposed over said layer in another of said contact windows, said emitter electrode entirely covering said another contact window, and said emitter electrode having a dimension exceeding the size of said another contact window by a quantity 2A, where A is a tolerance distance of positioning conductive electrodes with respect to said contact windows at either side of a normal position of said conductive electrodes;
- said emitter electrode and said base electrode separated by a distance B, said distance B being a minimum distance between said two electrodes;
- wherein said dimension E is at least equal to one of the value 2A or the value A+B, and wherein E is less than 2A+B.
A semiconductor device for a transistor comprising a semiconductor body having a surface;
- an insulating layer disposed on said surface;
- at least two adjacent contact windows disposed in said insulating layer and extending to said surface;
- a narrow region of said insulating layer separating said contact windows, said narrow region having a dimension E between said contact windows;
- a layer of a metal chemically combined with said semiconductor body, said layer entirely covering said surface within said contact windows;
- a base electrode disposed over said layer in one of said contact windows;
- an emitter electrode disposed over said layer in another of said contact windows;
- wherein said dimension E is equal to a distance B between said base and emitter electrodes, and wherein said emitter electrode and said base electrode only partially cover said contact windows.
A semiconductor device for a multicollector I.sup.2 L transistor comprising a semiconductor body having a surface;
- an insulating layer disposed adjacently on said surface;
- at least two collector contact windows disosed in said insulating layer and extending to said surface;
- a narrow region of said insulating layer separating said collector contact windows, said narrow region having a dimension E between said collector contact windows;
- a layer of a metal chemically combined with said semiconductor body, said layer entirely covering said surface within said collector contact windows;
- conductive collector electrodes partially disposed over said layer in said collector contact windows, wherein a distance B between said conductive collector electrodes is greater than said dimension E.
Dependencies are inferred from the claim text.