Apparatus providing signals for burn-in of integrated circuits

A burn-in board assembly for providing signals to electronic circuit package components, said burn-in board assembly being useable in an environmental chamber having a plurality of slots extending through a wall thereof comprising a first planar board of size sufficient to mount a desired number of the components, each of said components having a plurality of signal connection means, said first board having a plurality of edge contacts adjacent one edge thereof and connected to a first plurality of said signal connection means, said first board having a first length extending along the plane of the board in a direction perpendicular to the length of the one edge thereof, and at least one second auxiliary board portion mounted to the first board adjacent the edge of the first board having said contacts thereon and being spaced from the first board by a distance sufficient so that when the first board is passed through a slot in the wall of an environmental chamber, the auxiliary board passes through an adjacent slot in such wall, the auxiliary board having edge contacts aligning with the contacts of the first board and connected to a second plurality of signal connection means on the first board, the auxiliary board being substantially shorter than the first board in direction of the first length.