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US 4,899,920 AGranted
Apparatus for removal and installing electronic components with respect to a substrate
AssigneePace Incorporated
InventorsLouis A. Abbagnaro, Robert G. Brown, William J. Siegel, William J. Kautter, Robert S. Quasney, Sr.
Life of this patent
Estimating the term…
Abstract
This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).
Claims13
A heater assembly or removing or attaching electronic components with respect to a substrate, solder being associated with the components, comprising:
- means for delivering a gas;
- heater means for heating the gas;
- nozzle means for directing the heated gas to said solder applied to the leads of said electronic component and/or lands of said substrate where said component is:
- first temperature sensing means for sensing the temperature of said heater means;
- second temperature sensing means for sensing the temperature of said heated air;
- temperature control means responsive to said first and second temperature sensing means for controlling the temperatures of said heater means and said heated air substantially independently of one another;
- and the solder applied to the leads of an electronic component and/or lands or a substrate is heated to effect removal or attachment of the component with respect to said substrate via said leads and lands.
4 more elements
A heater assembly for removing or attaching electronic components with respect to a substrate, solder being associated with the components, comprising:
- means for delivering a gas;
- and heater means for heating the gas, said heater means including
- an elongated member having at least one groove in a first outer portion of the side thereof, said groove extending in the direction of elongation of the elongated member;
- an internal passage through which said gas passes;
- a heating element for heating said gas as it passes through the internal passage;
- a first temperature sensing member having an elongated support;
- at least two rows of spaced apart teeth outwardly projecting from the outer portions of the side of the elongated member other than said first outer portion, said rows of teeth also extending in the direction of elongation of the elongated member,
- said rows of teeth receiving said heating element and said groove receiving at least the elongated support of said first temperature sensing member with its elongated support,
- the heater element being formed around at least the elongated member;
- and the solder applied to the leads of an electronic component and/or lands of a substrate is heated to effect removal of attachmet of the component with respect to said substrate via said leads and lands.
7 more elements
Dependencies are inferred from the claim text.