Process for glow-discharge-activated reactive deposition of metal from a gas phase
AssigneeU.S. Philips Corporation
InventorsGeorg F. Gartner, Peter A. Janiel
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AssigneeU.S. Philips Corporation
InventorsGeorg F. Gartner, Peter A. Janiel
Estimating the term…
1. Process for flow-discharge-activated reactive deposition of metal from a gas phase. 2.1 For the reactive deposition of tubular metal bodies from a flowing gas phase which contains a metal halide, a glow discharge is generated between an inner electrode and an outer electrode, one of which is of tubular construction and serves as substrate. Under these circumstances, an unexpectedly low yield of the metal deposition is obtained in some cases. The novel process is intended to ensure a high metal deposition. 2.2 The reactive deposition from the gas phase is carried out in the high plasma resistance range. A preferred technique for establishing the high plasma resistance is to adjust the absolute mass flow of the metal halide to at least 60 sccm. 2.3 The novel process makes it possible to manufacture self-supporting thermionic cathodes and other self-supporting materials, layers and shaped bodies for high-temperature applications. 3. FIG. 2 is a plot showing the variation of the voltage drop Upl between cathode and anode with the absolute metal-halide mass flow Q.sub.abs.
A process for the reactive deposition of tubular metal bodies on a tubular substrate from a flowing gas phase containing a metal halide by a glow discharge generated in said gas phase and extending between an inner electrode and an outer electrode, one of which electrodes is tubular and serves as said substrate, characterized in that the absolute mass flow of the metal halide is adjusted to at least 60 sccm and the reactive deposition from the gas phase is carried out in the high plasma resistance range.
Dependencies are inferred from the claim text.