Heat dissipating housing for a circuit component
AssigneeSiemens Aktiengesellschaft
InventorsBernhard Buselmeier, Herbert Prussas
Life of this patent
Estimating the term…
Loading patent…
AssigneeSiemens Aktiengesellschaft
InventorsBernhard Buselmeier, Herbert Prussas
Estimating the term…
A heat dissipating housing (W/Gl/G) for a circuit component (IC) consists of at least one bottom tub (G) and a cover (W) having a planar cover face. A frame-shaped portion of this cover face serves as a bearing surface (TF) for meeting a planar bearing surface (TF) of the sidewalls (G1) of the bottom tub (G). Both bearing surfaces (TF) are finally fastened together. At least parts of the cover's outside surface (W) are cooled in operation by a cooling medium (KL), dissipated heat being conveyed from the circuit component (IC) via a stiff heat conducting body (SC1, SC2) and a good heat conductor element consisting of elastic material (FE/WS/WL) to the cover (W). In each instance, at least one good heat conductor spring structure (WL/WS) with feather tongues (WL) is inserted in lateral gaps between the heat conducting body (SC1, SC2) and at least two of the sidewalls (G1) of the bottom tub (G) in an expanding manner by means of its feather tongues (WL) so that these spring structures (WL/WS) adhere through friction forces. The element (FE) and the spring structures (WS/WL) are formed as a cohering spring unit (Fe/WL/WS) from a single piece of spring plate with a center part (FE) and side parts (WS). The good heat conductor cover (W) is connected with the center part (FE) firmly and heat conductingly. Centering retention of cover (w) by the spring unit inhibits displacement of cover (w) relative to the sidewalls.
A heat dissipating housing with a circuit component giving off heat in operation, such as a driver chip where
Dependencies are inferred from the claim text.