Chip-type resistor
AssigneeTDK Corporation
InventorsTetsuo Takahashi, Eisaku Miyauchi, Masayuki Yoshida, Shunichi Kumagai, Akio Sasaki
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Abstract
A chip resistor having configuration and dimensions of high precision and capable of operating with high reliability. The chip resistor includes end electrodes deposited on both side end surfaces of an insulating substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover the side end surfaces of the substrate. A resistance element may be formed according to either a thick film deposition technique or a thin film deposition technique. Also, a method for manufacturing such a chip resistor is provided.
Claims29
A chip resistor comprising:
- a chip-like insulating substrate;
- a resistance element arranged on at least one surface of said substrate;
- an end electrode made of a metal film deposited on each of side end surfaces of said substrate according to a thin film deposition technique, said end electrode being integrally formed into a substantially C-shape so as to continuously and throughly cover each of said side end surfaces and be connected to said resistance element.
A chip resistor comprising:
- a chip-like insulating substrate;
- a resistance element deposited on an upper surface of said substrate according to a thick film deposition technique;
- and
- an end electrode comprising a metal film deposited on each of side end surfaces of said substrate according to a thin film deposition technique, said end electrode being integrally formed into a substantially C-shape so as to continuously and thoroughly cover each of said side end surfaces and be connected to said resistance element.
A chip resistor comprising:
- a chip-like insulating substrate;
- a resistance element formed on said substrate according to a thin film deposition process so as to continuously cover an upper surface, both side end surfaces and a part of lower surface of said substrate;
- and
- end electrodes made of a metal film deposited on said resistance film according to a thin film deposition technique, said end electrodes each being integrally formed into a substantially C-shape so as to continuously and thoroughly cover each of said side end surfaces.
A chip resistor assembly comprising:
- a base plate;
- and
- a plurality of chip resistors arranged on said base plate in a predetermined positional relationship;
- said chip resistors each comprising a chip-like insulating substrate, a resistance element deposited on an upper surface of said substrate according to a thick film deposition technique, and an end electrode comprising a metal film deposited on each of side end surfaces of said substrate according to a thin film deposition technique and integrally formed into a substantially C-shape so as to continuously and thoroughly cover each of said side end surfaces and be connected to said resistance element.
A process for manufacturing a chip resistor comprising the steps of:
- providing a punched insulating substrate material which has a plurality of slit-like apertures formed in parallel with one another at predetermined intervals and a plurality of bar-like sections provided between respective adjacent two said slit-like apertures and formed integral with one another;
- forming a resistance element on each of predetermined positions of an upper surface of each of said bar-like sections of said substrate material according to a thick film deposition technique;
- depositing end electrodes on each of side end surfaces of each of said bar-like sections of said substrate material in a manner to positionally correspond to each of said resistance element according to a thin film deposition technique, said end electrodes each being integrally formed into a substantially C-shape so as to continuously and thoroughly cover each of said side end surfaces and be connected to said resistance element;
- separating said bar-like sections from one another;
- and
- dividing each of said separated bar-like sections into chip-like substrate units to obtain said chip resistor.
A process for manufacturing a chip resistor comprising the steps of:
- forming a resistance element on an insulating substrate material according to a thin film deposition technique so as to continuously cover an upper surface, both side end surfaces and a part of a lower surface of said insulating substrate material;
- depositing an electrode film on said resistance element according to a thin film deposition technique;
- subjecting said electrode film to etching to form end electrodes each of which is integrally formed into a substantially C-shape so as to continuously and thoroughly cover each of side end surfaces;
- subjecting said resistance element to etching to form predetermined patterns of said resistance element;
- and
- dividing said substrate material into a plurality of chip-like substrate units to obtain said chip resistor.
Dependencies are inferred from the claim text.