Lead frame and semiconductor device using the same

A semiconductor device comprising a tab, tab suspending leads extended from the side of said tab by way of connection portions located between said tab and tab suspending leads, a pellet bonded to said tab, a plurality of leads disposed at the periphery of said tab, bonding wires in which a plurality of bonding electrodes in the pellet and corresponding leads are wire-bonded to establish electric conduction, and a package in which at least said pellet, bonding wires and leads near the region connection with said bonding wires are resin-encapsulated, and wherein means are provided in said connection portions for stress relaxation, said means for stress relaxation comprising said connection portions between said tab and suspending leads being progressively widened by way of arcuate portions in a direction toward said tab and wherein the tab suspending leads each comprise a through hole therein located near the connection portions.