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US 4,790,876 AGranted
Chemical copper-blating bath
AssigneeNippondenso Co., Ltd.
InventorsKoji Kondo, Katuhiko Murakawa, Nobumasa Ishida, Junji Ishikawa, Kaoru Nomoto, Futoshi Ishikawa
Life of this patent
Estimating the term…
Abstract
In a chemical copper-plating bath comprising a copper sulfate, a complexing agent, a reducing agent, and a pH-adjusting agent, borofluoride is added to enhance the deposition speed of Cu, thus eliminating the problems of a complicated control of the bath.
Claims17
A chemical copper-plating bath, including a copper salt, a complexing agent, a reducing agent, a pH-adjusting agent, and an additive of borofluoride for accelerating the plating deposition speed.
Dependencies are inferred from the claim text.