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AssigneeTatsuta Electric Wire & Cable Co., Ltd.
InventorsKazumasa Eguchi, Fumio Nakatani, Shinichi Wakita, Hisatoshi Murakami, Tsunehiko Terada
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A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.
A conductive copper paste composition for application to an insulation substrate to form conductive circuit comprising a copper metal power, a resin component including a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, a metal chelating agent and a soldering accelerator.
A conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or a metal salt thereof assisting in the uniform dispersion of said copper metal powder into said resin component, and a metal chelating agent.
a conductive copper paste composition for application to an insulation substrate to form a conductive circuit comprising a copper metal powder, a resin component including a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid component for assisting in uniformly dispersing said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the composition to solders, and a soldering accelerator for further improving receptivity of the composition to solders.
A conductive copper paste composition for application to an insulation circuit to form a conductive circuit comprising a copper metal powder, a resin component including a metal surface activator resin and a thermosetting resin for dispersing the copper metal powder therein, a fatty acid or metal salt of a fatty acid for assisting in uniformly dispersing said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivety of the composition to solders.
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform dispersion of of said copper metal powder in said resin component, a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders, and a soldering accelerator for further improving receptivity of the film to solders.
A cured film forming a conductive circuit on an insulation substrate comprising a copper metal powder dispersed in a resin component including a metal surface activator resin and a thermosetting resin, a fatty acid or metal salt thereof assisting in the uniform disperson of said copper metal powder in said resin component, and a metal chelating agent for inhibiting oxidation of said copper metal powder to maintain conductivity and improving receptivity of the film to solders.
Dependencies are inferred from the claim text.