Socket device for fine pitch lead and leadless integrated circuit package

In a socket device for an integrated circuit (IC) package, said socket device including a base having means for supporting said IC package, opposed actuating latches pivotally carried by said base located on opposite sides of said IC supporting means and pivotally shiftable between open positions in which said IC package can be received upon said IC supporting means and closed positions overlying and retaining said IC package when upon the IC supporting means, biasing means for normally urging said latches into their latching closed positions, contacts carried by said base for engaging said IC package when upon said IC supporting means with said latches in their closed positions, the improvement wherein each contact includes a body carried by said base extending upwardly from the base and a tip, said contacts along each side of said IC supporting means being in multiple ranks so as to laterally offset the bodies of said contacts in one rank from those of the other rank along each side where the bodies extend upwardly from the base and with said tips of the contacts along each side being aligned to engage said IC package, said contact bodies engaging said latches for opening and closing movement with the latches to accommodate receiving said IC package upon said IC supporting means as the latches are shifted between their open and closed positions.